SURFACE MOUNT STANDARDS, SPECIFICATIONS AND GUIDELINES

The following was provided by Tony Hilvers of the IPC who should be contacted for further information on the document and standards.

COMPONENTS

E1A-481-A      	Taping of Surface Mount Components for Automatic Placement
E1A-PDP-100    	Mechanical Outlines for Registered and Standard Electronic Parts
E1A-JEP-95     	JEDEC Registered and Standard Outlines for Semiconductor Devices
E1A-JESD-11    	Chip Carrier Pinouts Standardized for CMOS 4000, HC and HCT series of Logic Circuits
E1A-CB-11      	Guidelines for the Surface Mounting Multilayer Ceramic Chip Capacitors
E1A-1S-28      	Fixed Tantalum Chip Capacitor style 1-Protected Capacitance range
E1A-1S-29      	Fixed Tantalum Chip Capacitor Style 1-Protected Extended Capacitance range
E1A-1S-36      	Chip Capacitors, Multilayer (Ceramic Dielectric)
E1A-1S-37      	Multiple-Layer High Voltage Capacitors (Radial Lead Chip Capacitor)
IEC-384-3      		Sectional Specification, Tantalum Chip Capacitors
IEC-384-10     	Sectional Specification, fixed Multilayer Ceramic Chip Capacitors
IECQ Draft     	Blank Detail Specification, Fixed Multilayer Ceramic Chip Capacitors
IECQ-PQC-31    	Sectional Specification, Fixed Tantalum Chip Capacitors with Solid Electrolyte
IECQ-PQC-32    	Blank Detail Specification, Fixed Tantalum Chip Capacitor
E1A-506        		Dimensional and Functional characteristics
               		Defining Sockets for leadless type A chip carriers (0.050 spacing)
E1A-507        		Dimensional Characteristics Defining Edge Clips for use with Hybrids and Chip Carriers
E1A-1S-47      	Contact Termination Finish Standard for Surface Mount Devices

PRINTED BOARDS

IPC-FC-250       	Performance Specification for singleand double sided flexible printed boards
IPC-SD-320       	Performance Specification for rigid single and double sided printed board
IPC-ML-950       	Performance Specification for Multilayer Printed boards
MIL-P-50884      	Military  Specification Printed Wiring Flexible and Rigid Flex

MIL-P-55110      	Military Specification Printed Wiring Boards General Specification Form
IPC-SM-817       	General Requirements for SMT Adhesives
IPC-SF-818       	General Requirements for Electronic Soldering  fluxes
IPC-SP-819      	General Requirements for Electronic-Grade Solder paste
IPC-CC-830       	Qualification and Performance of electrical insulation compounds for Printed Board Assemblies
IPC-SM-840       	Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards
MIL-F-14256      	Flux, Soldering, Liquid (Rosin Base)

DESIGN ACTIVITIES

IPC-T-50         	Terms and Definitions for Electronic Interconnections
IPC-CM-78        	Surface Mount and Interconnecting Chip Carrier Guidelines
IPC-H-855       	Hybrid Microcircuit Design Guide
IPC-D-249        	Design Standard for Flexible single and double sided Printed boards
IPC-D-317        	Design Standard for Electronic Packaging Utilizing High-speed Techniques
IPC-D-319        	Design Standards for Rigid Single-and Double Boards
IPC-SM-782       	Surface Mount Land Patterns (configuation and Design rules)
IPC-D-859        	Design Standard for Multilayer Hybrid Circuits
IPC-D-949        	Design Standard for Rigid Multilayer Printed Boards
MIL-STD-275      	Military Standard Printed Wiring for Electronic Equipment
MIL-STD-2118     	Design Standard for Flexible Printed Wiring.

COMPONENT MOUNTING

E1A Bulletin CB-11	Guidelines for Surface Mounting of Multilayer Ceramic Capacitors
IPC-CM-770           	Guidelines for Printed Board Component Mounting
IPC-SM-784           	Guidelines for Direct Chip Attachment
DOD-STD-2002-2   Part and Component Mounting for High Quality/ High-reliability Soldered Electrical and Electronic Assemblies
SMC-TR-001           	An introduction to Tape Automated Bonding and Fine Pitch Technology

ATTACHMENT TECHNIQUES

IPC-SM-780           	Electronic Component Packaging and Interconnection with Emphasis on Surface  Mounting

SOLDERING AND SOLDERABILITY

EIA-1S-46           	Test Procedure for Resistance to Soldering: Vapour Phase Technique for Surface Devices
E1A-1S-49            	Solderability Test Procedures
E1A-448-19           	Test Standard for Electromechanical components
                     		Environmental Effects of Machine Soldering using a Vapour Phase System-Method 19
IPC-S-804            	Solderability Test Method for Printed Wiring Boards
IPC-S-805            	Solderability Test for component Leads and Terminations
IPC-S-815            	General requirements for Soldering Electronic Interconnections
IPC-S-816            	Troubleshooting for Surface Mount Soldering
DOD STD-2000-1      Soldering Technology, High-Quality/High Relibility
DOD-STD-2000-4      General Soldering Requirements for Electrical Equipment

QUALITY ASSESSMENT

E1A-469-A           	Standard Test Method for Destructive Physical Analysis of High-Reliability Ceramic Monolithic Capacitors (embraces chips)

E1A-510              	Standard Test Method for Destructive Physical Analysis of Industrial-Grade Ceramic Monolithic Capacitors (embraces chips)
IPC-A-600            	Acceptability of Printed Boards
IPC-A-610            	Acceptability of Printed Boards Assemblies
MIL-STD-883          	Methods of Procedures for Microelectronics

RELIABILITY

IPC-A-38            	Fine-Line Round Robin Test Pattern
IPC-A-48            	Surface Mount Artwork
IPC-SC-60           	Post-Solder Solvent Cleaning Handbook
IPC-AC-62           	Post-Solder Aqueous Cleaning Handbook
IPC-A1-640          	User Requirements for Automatic Inspection of Unpopulated Thick Film Hybrid Substrates
IPC-A1-641          	User Guidelines for Automated Solder Joint Inspection Systems
IPC-A1-642          	User Guidelines for Automated Inspection of Artwork and Innerlayers
IPC-A1-643          	User Guidelines for Automatic Optical Inspection of Populated packaging and Interconnection Assemblies
DOD-STD-2000-3      Criteria for High-Quality/High-Reliability Soldering Technology
IPC-SM-785          	Guidelines for Accelerated Surface Mount  Attachment Reliability Testing

TEST METHODS

E1A-JEDEC           	Method B 105-A, Lead Integrity-Plastic Leaded Chip Carrier (PLCC) Packages
E1A-JEDEC           	Method B 102, Surface Mount solderability Test (JESD 22-B)
E1A-JEDEC           	Method B 108, Coplanarity (intended for inclusion into JESD 22-C)
IPC-TM-650          	Test methods manual

REPAIR

IPC-R-700           	Guidelines for Repair and Modification of Printed Board Assemblies

IN CIRCULATION FOR MEMBERSHIP APPROVAL

IPCC-C-406          	Design and Application Guidelines-Surface Connectors-Chairman, Tom Moyer, Dupont Connector Systems
IPC-A-610A          	Acceptability of Electronic Assemblies - Chairman, AL Seabright, Computing Devices
IPC-SM-817          	General Requirements for SMT Adhesives - Chairman, Richard Thompson, Loctite

IN CIRCULATION FOR COMMITTEE REVIEW

IPC-D-317          	Guidelines for Electronic packaging Utilizing High-Speed Techniques - Chairman,  Dana Korf, Bell Northern Research
IPC-SM-784          	Guidelines for Chip-on-Board TechnologyImplementation - Chairman, Fred Verdi, AT & T

IN PROCESS

IPC-SM-816          	Troubleshooting for Surface Mount Soldering - Chairman, Les Hymes, G.E.
IPC-SM-785          	Guidelines for Accelarated Surface Mount Attachment Reliability Testing - Chairman,  Werner Engelmaier, AT & T Bell Labs
IPC-TR-786          	Technical Report on Impact of Moisture on plastic I/C Packaging Cracking - Chairman, Ray Prasad, Intel