Tin and bismuth alloy and oven melting.


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    Default Tin and bismuth alloy and oven melting.

    Dear friends, this is my first post in this area.


    Notoriously, ProtoBasic's followers tend to help each other and I'm here to ask for suggestions.


    I have to make welds that must be perfect and must not leave residues of firm dough and even less micro-spheres.


    At the moment I am using an oven with the possibility of calibrating the heating and melting temperature, but the result, although good, does not fully support me because around the weld it remains a sticky substance.


    I am using Sn42Bi58.

    Attached please find the timing.

    I would know more detail about this tecnology new for me.

    Can you please point me in the right direction where search the information that I need in order to design the better thermal curve, timing and select the best solder paste that do not generate residuals.?

    Leo
    Attached Files Attached Files

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    Default Re: Tin and bismuth alloy and oven melting.

    Wirecut,
    Any solder will leave a residue. It is true that there are low-residue welds. I use Indium brand low residue tin. This tin works well although the melting point is a little high. The reference is SAC305 INDIUM8.9HFTYPE4. The composition is Sn96.5Ag3.0Cu0.5. If you need 0 residue you will have to clean the PCB after soldering. I previously had a bench top oven and had problems with some areas of the PCBs, especially the ground planes. The tin I use needs 250ēC at least to melt well. A small bench top oven will not do a uniform job for several cycles in a row.

    Regards,
    Gamboa

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    Default Re: Tin and bismuth alloy and oven melting.

    Hi Gamboa.

    Thanks for your suggestion.

    I have found the solder paste that fuse at 179 degree and the supplier say "no clean".

    I have ordered a couple of syringe as a sample and then inform you.

    BR
    Leo

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